A Brief Discussion on the Future Development of Hardware Components
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2022-03-31
In recent years, the overall technological level of precision hardware components has improved rapidly, and the performance of many high-end, high-quality machines has now reached the level of their Japanese counterparts. Currently, some domestic companies have developed air-conditioner fin dies with a service life of up to 500 million strokes, placing them at the forefront of the domestic market in pile-driving equipment manufacturing. Furthermore, they have developed progressive dies for the production of high-precision micro connectors with a pitch of 0.4 mm, achieving a manufacturing accuracy of 0.5 mm; the smallest punch, measuring just 0.13 mm, is directly ground to a mirror finish, ensuring that the thinnest pin of the finished part measures only 0.17 mm, while bend accuracy meets stringent requirements of 0.01 mm and even complex S-shaped bends. In addition, there are extra-large, high-precision stamping dies for automatic lamination of motor cores, and the specialized production standards and capabilities associated with these dies are already among the best in China.
From 2016 to 2021, with the continuous emergence of new processes and new products, foreign hardware components have evolved from conventional single-station progressive dies to multifunctional modular assemblies, production-line-compatible tooling sets, extra-large progressive dies, and stamping dies for micro- and fine-part forming. In contrast, most Chinese enterprises still focus on the standardization and industrialization of conventional single-station progressive die series, and have yet to master key technologies for specialized, high-precision, cutting-edge dies—such as extra-large high-precision dies, ultra-high-speed stamping dies, dies for ultra-thin, ultra-strong, and micro- and fine-part forming—and there is relatively limited design of multifunctional composite dies. Therefore, China must continue to conduct research on key technologies for new types of dies, expand their application areas, and lay a solid foundation for catching up with and surpassing international advanced levels.
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2022/03/31
2022/03/31
2022/03/31
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